19 V+B Evaluation Board 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL59911. For more information on MSL please see techbrief TB363. BREF 16 GND 15 ENABLE 14 BCM 13 17 V-B VSOUT/GCM 12 BIN- 9 HSOUT/RCM 11 18 BOUT V+ 10 ISL59911IRZ-EVALZ L32.5x6C 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. BIN+ 8 FN7548 Rev 0.00 September 2, 2011 32 Ld QFN 24 ROUT 22 V-G EXPOSED DIEPLATE SHOULD BE CONNECTED TO V- (-5V) 59911 IRZ 1. Add "-T*" suffix for tape and reel. Please refer to TB347 for details on reel specifications. RIN+ 4 GIN+ 6 ISL59911IRZ PKG. DWG. # NOTES: 23 V-R THERMAL PAD
19 V+B Evaluation Board 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL59911. For more information on MSL please see techbrief TB363. BREF 16 GND 15 ENABLE 14 BCM 13 17 V-B VSOUT/GCM 12 BIN- 9 HSOUT/RCM 11 18 BOUT V+ 10 ISL59911IRZ-EVALZ L32.5x6C 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. BIN+ 8 2 32 Ld QFN 24 ROUT 22 V-G EXPOSED DIEPLATE SHOULD BE CONNECTED TO V- (-5V) 59911 IRZ 1. Add "-T*" suffix for tape and reel. Please refer to TB347 for details on reel specifications. RIN+ 4 GIN+ 6 ISL59911IRZ PKG. DWG. # NOTES: 23 V-R THERMAL PAD PACKAGE (Pb-free) 25 V+R V- 3 R